Huawei Patents Two Silicon Carbide Cooling Technology to Power Next-Gen AI Chips

Huawei has taken a significant step in advanced chip thermal management, revealing two new patents in China for silicon carbide (SiC) cooling technology aimed at solving the intensifying heat dissipation challenges faced by next-generation AI chips.

As AI workloads grow more complex and chip densities rise, thermal management is rapidly becoming a critical bottleneck for performance and reliability in high-power devices.

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Next-Gen Thermal Management: The SiC Solution

The recently disclosed patents, published through China’s National Intellectual Property Administration, detail two innovative SiC-based cooling chip compositions. Both designs utilize high-purity silicon carbide—with a mass content equal to or greater than 99%—to maximize thermal conductivity and stability in compact, high-power devices.

In one composition, a mix of large and small SiC particles in a 3:1 ratio enhances heat transfer, while the spherical shape of the particles (sphericity > 0.8) allows for smoother flow and more efficient thermal performance. The second patent introduces a hybrid approach, combining highly spherical SiC fillers with spherical ferrite, a material that can absorb and temporarily store heat, further preventing temperature spikes during intensive AI workloads.

Why Cooling Technology Matters for AI Chips ?

Modern AI chips are increasingly power-hungry, densely packed with processing cores, and tasked with handling everything from real-time language translation to advanced image analysis. This leads to significant heat buildup, which, if unmanaged, can throttle performance, degrade battery life, and reduce device longevity.

Conventional cooling methods—like metallic heat sinks and passive thermal pads—are reaching their physical limits as AI chips continue to shrink in size and grow in power demands. By leveraging high-purity SiC’s superior thermal conductivity, Huawei’s approach promises to keep chips cooler under heavy loads, enabling sustained peak performance for longer periods. For consumers, this could translate to smoother gaming, more reliable multitasking, and enhanced device comfort, especially in flagship smartphones like the anticipated Mate 80 series.

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Industry Impact and Regional Significance

While global media coverage remains limited, the news has sparked notable discussion within Chinese and regional tech communities about the potential boost to domestic chip innovation and AI competitiveness. Analysts suggest that Huawei’s SiC cooling technology could give China an edge as it works to establish leadership in semiconductor design and AI hardware.

The patents’ focus on material purity and particle morphology sets them apart from earlier cooling innovations, such as microchannel cooling designs found in prior art, which primarily used silicon substrates and less advanced packing methods. Background patents show that SiC can tolerate higher operating temperatures than silicon, but Huawei’s new method targets both conductivity and stability at the material level.

Comparison Table: Cooling Technologies for AI Chips

What Comes Next?

As Huawei moves forward with these patented designs, industry watchers will be keen to see their adoption in commercial products—especially flagship devices like the Mate 80 series. If successful, these SiC cooling chips could redefine expectations for AI hardware efficiency and reliability. For readers wanting to discuss the latest chip technologies and join the growing tech community, join our WhatsApp group for real-time updates and expert analysis.